Air pocket resistant semiconductor package system

ABSTRACT

A die is attached to a substrate and is enclosed in a heat spreader, the heat spreader having a first encapsulant guide and a heat spreader air vent in the heat spreader extending therethrough. An encapsulant encapsulates the die, the substrate, at least a portion of the heat spreader, the first encapsulant guide, and the heat spreader air vent such that the encapsulant enters the heat spreader through the first encapsulant guide and air exits the heat spreader through the heat spreader air vent, thus preventing the formation of air pockets under the heat spreader.

TECHNICAL FIELD

The present invention relates generally to integrated circuits, and moreparticularly to package structures for integrated circuits.

BACKGROUND ART

In the electronics industry, a continuing objective is to further andfurther reduce the size of electronic devices while simultaneouslyincreasing performance and speed. Cellular telephones, personal datadevices, notebook computers, camcorders, and digital cameras are but afew of the consumer products that require and benefit from this ongoingminiaturization of sophisticated electronics.

Integrated circuit (“IC”) assemblies for such complex electronic systemstypically have a large number of interconnected IC chips. The IC chips,commonly called dies, are usually made from a semiconductor materialsuch as silicon or gallium arsenide. Photolithographic techniques areused to form the various semiconductor devices in multiple layers on thedies.

Dies are encapsulated in a molded plastic package that has connectors orleads on the exterior of the package that function as input/outputterminals for the die inside the package. The package includes asubstrate, a die mounted on the top surface of the substrate, and a heatspreader mounted on the substrate and covering the die.

The substrate may be comprised of a flexible resin tape, a rigidfiber-glass/copper sheet laminate, a co-fired ceramic coupon, a flexiblemetal lead frame, a ball grid array substrate or other well-known typesof substrates in the semiconductor industry, depending on the particulartype of semiconductor package being used.

The die is conventionally mounted to the top surface of the substratewith, for example, a layer of an adhesive or an adhesive film, and thenelectrically connected to the substrate by a number of fine, conductivewires, typically gold (Au) or aluminum (Al), that electrically connectthe die to the substrate. The wires are attached to the die at thebonding pads of the die, which are located around the periphery of thedie.

The heat spreader is made of a thermally conductive material, usuallymetal, to improve heat transfer. The heat spreader, covering the die andconductive wires, is attached to the substrate with an adhesive, athermal paste, or grease. To prevent electrical interference and shortcircuits, the heat spreader does not touch the die or the conductivewires. Thus, a heat spreader cavity is formed under the heat spreader.

After the heat spreader is attached, the die, the substrate, the heatspreader, and the conductive wires are encapsulated in a mold compound,such as plastic or epoxy, or in a multi-part housing made of plastic,ceramic, or metal. The encapsulation protects the substrate, the heatspreader, the fine conductive wires, and the die from physical,electrical, moisture, and/or chemical damage.

The encapsulation process begins by placing a mold over the die, thesubstrate, the heat spreader, and the conductive wires. Next, a moldcompound is injected into the mold. The mold compound flows through themold, encasing the die, the substrate, the heat spreader, and theconductive wires.

In order for the heat spreader to efficiently transfer heat, and for themold compound to protect the die, the substrate, the heat spreader, andthe conductive wires, the mold compound must fill the mold and thecavity under the heat spreader. Thus, air must be removed from the moldand from under the heat sink. However, efficient, simple, and costeffective air removal under the heat sink continues to remain a problemduring the encapsulation process. In view of the ever-increasing need tosave costs and improve efficiencies, it is more and more critical thatanswers be found to such problems.

Solutions to these problems have been long sought but prior developmentshave not taught or suggested any solutions and, thus, solutions to theseproblems have long eluded those skilled in the art.

DISCLOSURE OF THE INVENTION

The present invention provides a method for manufacturing an air pocketresistant semiconductor package. A die is attached to a substrate and isenclosed in a heat spreader, the heat spreader having a firstencapsulant guide and an heat spreader air vent in the heat spreaderextending therethrough. An encapsulant encapsulates the die, thesubstrate, at least a portion of the heat spreader, the firstencapsulant guide, and the heat spreader air vent such that theencapsulant enters the heat spreader through the first encapsulant guideand air exits the heat spreader through the heat spreader air vent, thuspreventing the formation of air pockets under the heat spreader.

Certain embodiments of the invention have other advantages in additionto or in place of those mentioned above. The advantages will becomeapparent to those skilled in the art from a reading of the followingdetailed description when taken with reference to the accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view, taken along line 1—1 in FIG. 4, of anair pocket resistant semiconductor package in an intermediate stage ofmanufacture, in accordance with an embodiment of the present invention;

FIG. 2 illustrates the structure of FIG. 1 undergoing encapsulation;

FIG. 3 shows the structure of FIG. 2 after encapsulation;

FIG. 4 is a top view of the air pocket resistant semiconductor packageof FIG. 1 in an intermediate stage of manufacture;

FIG. 5 is a perspective view of the structure of FIG. 4 afterencapsulation;

FIG. 6 is a cross-sectional view, taken along line 6—6 in FIG. 9, of analternate embodiment of an air pocket resistant semiconductor package inan intermediate stage of manufacture, in accordance with the presentinvention;

FIG. 7 illustrates the structure of FIG. 6 undergoing encapsulation;

FIG. 8 shows the structure of FIG. 7 after encapsulation;

FIG. 9 is a top view of the air pocket resistant semiconductor packageof FIG. 6 in an intermediate stage of manufacture;

FIG. 10 is a perspective view of the structure of FIG. 9 afterencapsulation;

FIG. 11 is a cross-sectional view, taken along line 11—11 in FIG. 14, ofan another embodiment of an air pocket resistant semiconductor packagein an intermediate stage of manufacture, in accordance with the presentinvention;

FIG. 12 illustrates the structure of FIG. 11 undergoing encapsulation;

FIG. 13 shows the structure of FIG. 12 after encapsulation;

FIG. 14 is a top view of the air pocket resistant semiconductor packageof FIG. 11 in an intermediate stage of manufacture;

FIG. 15 is a perspective view of the structure of FIG. 14 afterencapsulation; and

FIG. 16 is a flow chart of a method for manufacturing an air pocketresistant semiconductor package in accordance with an embodiment of thepresent invention.

BEST MODE FOR CARRYING OUT THE INVENTION

In the following description, numerous specific details are given toprovide a thorough understanding of the invention. However, it will beapparent that the invention may be practiced without these specificdetails. In order to avoid obscuring the present invention, somewell-known package configuration structural components and process stepsare not disclosed in detail.

The drawings showing embodiments of the invention are semi-diagrammaticand not to scale and, particularly, some of the dimensions are for theclarity of presentation and are shown exaggerated in the FIGs. Also,where multiple embodiments are disclosed and described having somefeatures in common, for clarity and ease of illustration, description,and comprehension thereof, like features one to another will ordinarilybe described with like reference numerals.

The term “horizontal” as used herein is defined as a plane parallel tothe conventional plane or surface of a die, die paddle (or “pad”), ordie package, regardless of its orientation. The term “vertical” refersto a direction perpendicular to the horizontal as just defined. Terms,such as “on”, “above”, “below”, “bottom”, “top”, “side” (as in“sidewall”), “higher”, “lower”, “over”, and “under”, are defined withrespect to the horizontal plane.

The term “processing” as used herein includes deposition of material,patterning, exposure, development, etching, cleaning, and/or removal ofthe material as required in forming a described structure.

The term “air” is used herein to describe a generic gas and couldinclude atmospheric air or inert gasses such as argon.

Referring now to FIGS. 1 and 4, therein is shown a cross-sectional view,taken along line 1—1 in FIG. 4, of an air pocket resistant semiconductorpackage 100 in an intermediate stage of manufacture, in accordance withan embodiment of the present invention. A die 102 is attached to asubstrate 104 with an epoxy 106. The substrate 104 may be comprised of aflexible resin tape, a rigid fiber-glass/copper sheet laminate, aco-fired ceramic coupon, a flexible metal lead frame, a ball grid arraysubstrate or other well-known types of substrates in the semiconductorindustry, depending on the particular type of semiconductor packagebeing used.

The die 102 is then electrically connected to the substrate 104 by anumber of fine, conductive wires 108, typically gold or aluminum. Thewires 108 are wire bonded to the die 102 around the periphery of the die102, typically with automated wire bonding equipment employingwell-known thermal-compression or ultrasonic wire bonding techniques.

A heat spreader 112, optionally having corners, is then attached to thesubstrate 104 with an adhesive 114. The heat spreader 112 is made of athermally conductive material, usually metal, to improve heat transfer.To prevent electrical interference and short circuits, the heat spreader112 encloses and covers, but is free of contact with, the die 102, theepoxy 106, and the conductive wires 108. Thus, the heat spreader 112 isformed to have a heat spreader cavity 116.

An encapsulant guide 120 is formed to be a depression in the top of theheat spreader 112. The encapsulant guide 120 is in the shape of a funnelwith sloped sides. At the bottom of the funnel is an opening 121 throughthe heat spreader 112. A heat spreader air vent 118 is a groove throughthe base of the heat spreader 112. Thus, the only breaches in the heatspreader 112 are the opening 121 and the heat spreader air vent 118.

Referring now to FIG. 2, therein is shown the structure of FIG. 1 afterfurther processing. A mold 202 covers the substrate 104 and encloses thedie 102, the epoxy 106, the conductive wires 108, the heat spreader 112,the adhesive 114, the heat spreader cavity 116, the heat spreader airvent 118, and the encapsulant guide 120. The mold 202 creates a moldcavity 203 between the mold 202 and the surface of the heat spreader112. The mold 202 has a mold air vent 205 located at the base of themold 202 above the heat spreader air vent 118.

It has been discovered that the heat spreader air vent 118 and theencapsulant guide 120 reduce the amount of air trapped in the heatspreader cavity 116 during encapsulation. An encapsulant 204 is injectedthrough an injection port 206. The encapsulant 204 flows over theoutside of the heat spreader 112, fills the mold cavity 203, and forcesair from the mold cavity 203 out through the mold air vent 205. Aftercompletely filling the mold cavity 203, the encapsulant 204 flowsthrough the encapsulant guide 120 at the center of the heat spreader112, filling the heat spreader cavity 116. As the encapsulant 204 fillsthe heat spreader cavity 116, air is forced from the heat spreadercavity 116, through the heat spreader air vent 118, and out through themold 202.

Referring now to FIG. 3, therein is shown the structure of FIG. 2 afterfurther processing. The encapsulant 204 has hardened, thus encapsulatingthe substrate 104, the die 102, the epoxy 106, the conductive wires 108,the heat spreader 112, the adhesive 114, the heat spreader cavity 116,the heat spreader air vent 118, and the encapsulant guide 120. Theencapsulant 204 has filled the heat spreader cavity 116, forcing air outthrough the heat spreader air vent 118.

Referring now to FIG. 4, therein is shown a top view of the air pocketresistant semiconductor package 100 in an intermediate stage ofmanufacture. The heat spreader 112 is attached to the substrate 104. Theencapsulant guide 120 is located at the center of the heat spreader 112.One corner of the heat spreader 112 is aligned with a pin one guide 402.A number of heat spreader air vents 118 are positioned at the base ofthe heat spreader 112 at all corners. The heat spreader air vent 118 atthe corner aligned with the pin one guide 402 is smaller and off center,allowing room for the injection port 206 (FIG. 2). Mold air vents 205(FIG. 2) are located at all corners except the corner aligned with thepin one guide 402.

During the encapsulation process, the injection port 206 (FIG. 2) alignswith the pin one guide 402. The encapsulant 204 (FIG. 2) is injectedthrough the injection port 206 and into the mold 202 (FIG. 2).

Referring now to FIG. 5, therein is shown the structure of FIG. 4, afterfurther processing. The encapsulant 204 has hardened, thus encapsulatingthe heat spreader 112 (FIG. 4), the heat spreader air vents 118 (FIG.4), and the encapsulant guide 120 (FIG. 4). The pin one guide 402 isvisible on the substrate 104.

Referring now to FIGS. 6 and 9, therein is shown a cross-sectional view,taken along line 6—6 in FIG. 9, of an alternate embodiment of an airpocket resistant semiconductor package 600 in an intermediate stage ofmanufacture, in accordance with the present invention. A die 602 isattached to a substrate 604 with an epoxy 606. The die 602 is thenelectrically connected to the substrate 604 by a number of fineconductive wires 608. The wires 608 are wire bonded to the die 602around the periphery of the die 602.

A heat spreader 612 having corners is then attached to the substrate 604with an adhesive 614. The heat spreader 612 encloses and covers, but isfree of contact with, the die 602, the epoxy 606, and the conductivewires 608. Thus, the heat spreader 612 is formed to have a heat spreadercavity 616. In addition, the heat spreader 612 has a heat spreader airvent 618, a first encapsulant guide 620, and a second encapsulant guide622.

A first encapsulant guide 620 is formed to be a depression in the top ofthe heat spreader 612. The first encapsulant guide 620 is in the shapeof a funnel with sloped sides. At the bottom of the funnel is an opening621 through the heat spreader 612. However, the second encapsulant guide622 does not have an opening through the heat spreader 612. Instead, thesecond encapsulant guide 622 is positioned on the external surface ofthe heat spreader 612 and connects a top edge of the heat spreader 612to the first encapsulant guide 620, located at the center of the heatspreader 612 extending therethrough. The heat spreader air vent 618 is agroove through the base of the heat spreader 612. Thus, the onlybreaches in the heat spreader 612 are the opening 621 and the heatspreader air vent 618.

Referring now to FIG. 7, therein is shown the structure of FIG. 6 afterfurther processing. A mold 702 covers the substrate 604 and encloses thedie 602, the epoxy 606, the conductive wires 608, the heat spreader 612,the adhesive 614, the heat spreader cavity 616, the heat spreader airvent 618, the first encapsulant guide 620, and the second encapsulantguide 622. The mold 702 contacts the top surface of the heat spreader612, creating a mold cavity 703 around the heat spreader 112. The mold702 has a mold air vent 705 located at the base of the mold 702 abovethe heat spreader air vent 618.

It has been discovered that the heat spreader air vent 618 and theencapsulant guide 620 reduce the amount of air trapped in the heatspreader cavity 616 during encapsulation. An encapsulant 704 is injectedthrough an injection port 706. The contact between the mold 702 and thetop surface of the heat spreader 612 blocks the encapsulant 704 from thetop surface of the heat spreader 612. Thus, the encapsulant 704 flowsaround the outside of the heat spreader 612, fills the mold cavity 703,and forces air from the mold cavity 703 out through the mold air vent705. After completely filling the mold cavity 703, the encapsulant 704flows through the second encapsulant guide 622, located opposite theinjection port 706 and on the top surface of the heat spreader 612. Theencapsulant 704 then flows into the first encapsulant guide 620. Theencapsulant 704 flows through the first encapsulant guide 620, fillingthe heat spreader cavity 616. As the encapsulant 704 fills the heatspreader cavity 616, air is forced from the heat spreader cavity 616,through the heat spreader air vent 618, and out through the mold 702.

Referring now to FIG. 8, therein is shown the structure of FIG. 7 afterfurther processing. The encapsulant 704 has hardened, thus encapsulatingthe substrate 604, the die 602, the epoxy 606, the conductive wires 608,the heat spreader 612, the adhesive 614, the heat spreader cavity 616,the heat spreader air vent 618, the first encapsulant guide 620, and thesecond encapsulant guide 622. The encapsulant 704 has filled the heatspreader cavity 616, forcing air out through the heat spreader air vent618.

Referring now to FIG. 9, therein is shown a top view of the air pocketresistant semiconductor package 600 in an intermediate stage ofmanufacture. The heat spreader 612 is attached to the substrate 604. Onecorner of the heat spreader 612 is aligned with a pin one guide 902. Thesecond encapsulant guide 622 is positioned on the external surface ofthe heat spreader 612. The second encapsulant guide 622 connects a topedge of the heat spreader 612, at a corner opposite the pin one guide902, to the first encapsulant guide 620, located at the center of theheat spreader 612 extending therethrough. A number of air vents 618 arepositioned at the base of the heat spreader 612 at all corners. The heatspreader air vent 618 at the corner aligned with the pin one guide 902is smaller and off center, allowing room for the injection port 706(FIG. 2). Mold air vents 705 (FIG. 2) are located at all corners exceptthe corner aligned with the pin one guide 902.

During the encapsulation process, the injection port 706 (FIG. 7) alignswith the pin one guide 902. The encapsulant 704 (FIG. 7) is injectedthrough the injection port 706 and into the mold 702 (FIG. 7).

Referring now to FIG. 10, therein is shown the structure of FIG. 9,after further processing. The encapsulant 704 has hardened, and with theexception of the top surface of the heat spreader 612, the encapsulant704 encapsulates the heat spreader 612, the heat spreader air vents 618(FIG. 9), the first encapsulant guide 620 (FIG. 9), and the secondencapsulant guide 622 (FIG. 9). The pin one guide 902 is visible on thesubstrate 604. The top surface of the heat spreader 612 is exposed (notencapsulated) due to the blocking contact with the mold 702 (see FIG. 7)during the encapsulation process. Exposing the top surface of the heatspreader 612 in this manner advantageously facilitates heat dissipationfrom the package 600.

Referring now to FIGS. 11 and 14, therein is shown a cross-sectionalview, taken along line 11—11 in FIG. 14, of another embodiment of an airpocket resistant semiconductor package 1100 in an intermediate stage ofmanufacture, in accordance with the present invention. A die 1102 isattached to a substrate 1104 with an epoxy 1106. The die 1102 is thenelectrically connected to the substrate 1104 by a number of fine,conductive wires 1108. The wires 1108 are wire bonded to the die 1102around the periphery of the die 1102.

A heat spreader 1112 having corners is then attached to the substrate1104 with an adhesive 1114. The heat spreader 1112 encloses and covers,but is free of contact with, the die 1102, the epoxy 1106, and theconductive wires 1108. Thus, the heat spreader 1112 is formed to have aheat spreader cavity 1116.

An encapsulant guide 1120 is formed to be a depression in the top of theheat spreader 1112. The encapsulant guide 1120 is in the shape of afunnel with sloped sides. At the bottom of the funnel are openings 1121through the heat spreader 112. A heat spreader air vent 1118 is a groovethrough the base of the heat spreader 1112. Thus, the only breaches inthe heat spreader 1112 are the openings 1121 and the heat spreader airvent 1118.

Referring now to FIG. 12, therein is shown the structure of FIG. 11after further processing. A mold 1202 covers the substrate 1104 andencloses the die 1102, the epoxy 1106, the conductive wires 1108, theheat spreader 1112, the adhesive 1114, the heat spreader cavity 1116,the heat spreader air vent 1118, and the encapsulant guide 1120. Themold 1202 creates a mold cavity 1203 between the mold 1202 and thesurface of the heat spreader 1112. The mold 1202 has a mold air vent1205 located at the base of the mold 1202 above the heat spreader airvent 1118.

It has been discovered that the heat spreader air vent 1118 and theencapsulant guide 1120 reduce the amount of air trapped in the heatspreader cavity 1116 during encapsulation. An encapsulant 1204 isinjected through an injection port 1206. The encapsulant 1204 flows overthe outside of the heat spreader 1112, fills the mold cavity 1203, andforces air from the mold cavity 1203 out through the mold air vent 1205.After completely filling the mold cavity 203, the encapsulant 1204 flowsthrough the encapsulant guide 1120 at the center of the heat spreader1112, filling the heat spreader cavity 1116. As the encapsulant 1204fills the heat spreader cavity 1116, air is forced from the heatspreader cavity 1116, through the heat spreader air vent 1118, and outthrough the mold 1202.

Referring now to FIG. 13, therein is shown the structure of FIG. 12after further processing. The encapsulant 1204 has hardened, thusencapsulating the substrate 1104, the die 1102, the epoxy 1106, theconductive wires 1108, the heat spreader 1112, the adhesive 1114, theheat spreader cavity 1116, the heat spreader air vent 1118, and theencapsulant guide 1120. The encapsulant 1204 has filled the heatspreader cavity 1116, forcing air out through the heat spreader air vent1118.

Referring now to FIG. 14, therein is shown a top view of the air pocketresistant semiconductor package 1100 in an intermediate stage ofmanufacture. The heat spreader 1112 is attached to the substrate 1104.The encapsulant guide 1120 is located at the center of the heat spreader1112. One corner of the heat spreader 1112 is aligned with a pin oneguide 1402. A number of heat spreader air vents 1118 are positioned atthe base of the heat spreader 1112, at all corners except the corneraligned with the pin one guide 1402.

During the encapsulation process, the injection port 1206 (FIG. 12)aligns with the pin one guide 1402. The encapsulant 1204 (FIG. 12) isinjected through the injection port 1206 and into the mold 1202 (FIG.12).

Referring now to FIG. 15, therein is shown the structure of FIG. 14,after further processing. The encapsulant 1204 has hardened, thusencapsulating the heat spreader 1112 (FIG. 14), the heat spreader airvents 1118 (FIG. 14), and the encapsulant guide 1120 (FIG. 14). The pinone guide 1402 is visible on the substrate 1104.

Referring now to FIG. 16, therein is shown a flow chart of a method 1600for manufacturing an air pocket resistant semiconductor package inaccordance with an embodiment of the present invention. The method 1600includes providing a die attached to a substrate in a block 1602;enclosing the die in a heat spreader, the heat spreader having a firstencapsulant guide and an air vent in the heat spreader extendingtherethrough, in a block 1604; and encapsulating the die, the substrate,at least a portion of the heat spreader, the first encapsulant guide,and the air vent in an encapsulant such that the encapsulant enters theheat spreader through the first encapsulant guide and air exits the heatspreader through the air vent, thus preventing the formation of airpockets under the heat spreader in a block 1606.

Thus, it has been discovered that the air pocket resistant semiconductorpackage manufacturing method and apparatus of the present inventionfurnish important and heretofore unknown and unavailable solutions,capabilities, and functional advantages for preventing air pocketformation in semiconductor packages. The resulting process andconfigurations are straightforward, economical, uncomplicated, highlyversatile, and effective, and can be implemented by adapting knowncomponents for ready manufacturing, application, and utilization.

While the invention has been described in conjunction with a specificbest mode, it is to be understood that many alternatives, modifications,and variations will be apparent to those skilled in the art in light ofthe aforegoing description. Accordingly, it is intended to embrace allsuch alternatives, modifications, and variations which fall within thescope of the included claims. All matters hithertofore set forth hereinor shown in the accompanying drawings are to be interpreted in anillustrative and non-limiting sense.

1. A method for manufacturing an air pocket resistant semiconductorpackage, comprising: providing a die attached to a substrate; enclosingthe die in a heat spreader, the heat spreader having: a firstencapsulant guide, wherein the first encapsulant guide is located at thecenter of the heat spreader extending therethrough a second encapsulantguide positioned on the external surface of the heat spreader, thesecond encapsulant guide connecting an edge of the heat spreader to thefirst encapsulant guide; and a heat spreader air vent in the heatspreader extending therethrough; and encapsulating the die, thesubstrate, at least a portion of the heat spreader, the firstencapsulant guide, and the heat spreader air vent in an encapsulant suchthat the encapsulant enters the heat spreader through the firstencapsulant guide and air exits the heat spreader through the heatspreader air vent, thus preventing the formation of air pockets underthe heat spreader.
 2. The method of claim 1 wherein enclosing the die ina heat spreader further comprises enclosing the die in a heat spreaderhaving a plurality of encapsulant guides extending therethrough.
 3. Themethod of claim 1 wherein; providing a die attached to the substratefurther comprises providing a substrate having a pin one guide; andenclosing the die in a heat spreader further comprises enclosing the diein a heat spreader having a heat spreader air vent positioned at thebase of the heat spreader.
 4. The method of claim 1 wherein the firstencapsulant guide is formed to be a depression in the top of the heatspreader with at least an opening through the heat spreader in thedepression.
 5. A method for manufacturing an air pocket resistantsemiconductor package, comprising: providing a die attached by an epoxyto a substrate, the substrate with a pin one guide; electricallyconnecting the die to the substrate by a plurality of conductive wires;enclosing the die and the plurality of conductive wires in a heatspreader having: a first encapsulant guide located at the center of theheat spreader; a second encapsulant guide positioned on the externalsurface of the heat spreader the second encapsulant guide connecting atop edge of the heat spreader to the first encapsulant guide at a corneropposite the pin one guide; a plurality of corners having one corner ofthe heat spreader aligned with the pin one guide; and a plurality ofheat spreader air vents in the heat spreader extending therethrough, theheat spreader air vents positioned at the base of the heat spreader atall corners; encasing the die, the epoxy, the substrate, the conductivewires, the heat spreader, the first encapsulant guide, and the heatspreader air vents in a mold by: contacting the surface of the heatspreader with the mold, providing the mold with an injection port, andaligning the injection port with the pin one guide; and encapsulatingthe die, the epoxy, the substrate, the conductive wires, at least aportion of the heat spreader, the first encapsulant guide, and the heatspreader air vents in an encapsulant such that the encapsulant entersthe heat spreader through the first encapsulant guide and air exits theheat spreader through the heat spreader air vents, thus preventing theformation of air pockets under the heat spreader.
 6. The method of claim5 wherein enclosing the die and the plurality of conductive wires in aheat spreader further comprises enclosing the die and the plurality ofconductive wires in a heat spreader having a plurality of encapsulantguides located at the center of the heat spreader and extendingtherethrough.
 7. The method of claim 5 wherein; providing the dieattached by the epoxy to the substrate further comprises providing thesubstrate with a pin one guide; enclosing the die and the plurality ofconductive wires in a heat spreader further comprises; providing a heatspreader having corners; aligning one corner of the heat spreader to thepin one guide; and enclosing the die and the plurality of conductivewires in a heat spreader having a plurality of heat spreader air ventspositioned at the base of the heat spreader at all corners.
 8. Themethod of claim 5 wherein the first encapsulant guide is formed to be adepression in the top of the heat spreader with at least an openingthrough the heat spreader in the depression.